LED Encapsulation Materials for General Lighting
Good adhesion to metals, chips and other substrates
Good sulfur resistance and thermal shock performance
Translucent appearance
Applications
● Encapsulation for LED lighting components
● Encapsulation for LED backlight components
● Encapsulation for Auto LED lighting components
It is a kind of two-part, high temperature cure silicone resin, which is designed for SMD LED encapsulation and suitable for protection of chips and gold wire. The typical features are translucent appearance, good light transmission, sulfur resistance, excellent thermal shock performance, and good adhesion to frame and silver-plated coatings.
Specifications
Properties
8103
8105
7097S
8232
7098
8225
8136
8228
5004
5005S
8157
7136
Mix ratio
1:10
1:10
1:10
1:10
1:10
1:10
1:10
1:10
1:4
1:4
1:1
1:10
Viscosity
5200
4000
4600
4000
5300
3500
4300
4500
4000
4200
3600
4000
Refractive Index
1.55
1.54
1.55
1.54
1.54
1.52
1.54
1.50
1.54
1.54
1.41
1.41
Cure Condition
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr, 150℃*3hr
100℃*1hr,
150℃*3hr
Shore Hardness
D74
D62
D66
D62
D62
D65
D49
D45
A78
A75
A70
A55
Tensile Strength Mpa
12.5
11.0
7.0
11.0
6.5
7.0
3.0
3.0
2.0
2.5
6.5
LED encapsulation materials are specialized compounds used to encapsulate LED chips, providing protection from moisture, dust, and mechanical damage. These materials also enhance the optical performance of LEDs by improving light output and color stability. Common types of encapsulation materials include optical encapsulants and silicone materials for led, such as epoxy resins, silicone, and polyurethane. Choosing the right material can have a significant impact on the performance and durability of your LED products.
