Semiconductor gold plating machine
Gold plating has low contact resistance, good electrical conductivity, good weldability, corrosion resistance, so electroplating has a wide range of applications in integrated circuit manufacturing, for example: in the driver IC package commonly used electroplated gold bump; in CMOS/MEMS in the application of electroplating to make switch contacts and various structures, etc.; In the radar gold plating as an air bridge is applied; plating is also used for UBM barrier layer protection layer, and for a variety of lead bonding bonding surface and so on.
