The polyimide can be used as a dielectric layer for interlayer insulation, as a buffer layer, it can reduce stress and improve yield. As a protective layer, it can reduce the impact of the environment on the device, and it can also shield the a-particles to reduce or eliminate the soft error of the device.
The semiconductor industry uses polyimide as a high-temperature adhesive. In the production of digital semiconductor materials and MEMS system chips. The polyimide layer has good mechanical ductility and tensile strength, which helps to improve the polyimide layer.
And the adhesion between the polyimide layer and the metal layer deposited on it. The high temperature and chemical stability of polyimide play a role in isolating the metal layer from various external environments.