Wafer Back Grinding Wheel
E-Grind Back-Grinding wheels have developed the technology to combine diamond and bond to meet your requirements. Especially our advanced porosity technology makes it possible to grind all types of wafers with less bug-surface damage. Our Back-Grinding wheels use a special vitrified bond for rough grinding or a resin bond for fine finishing and improved process accuracy. Our back-grinding wheel features free cutting, excellent wear resistance, and good shape maintainability for long durability.
Performance of Wafer Back Grinding Wheel
Leading technology
Good self-sharpening
No dressing required
High yeild rate of work-piece
Applications of Wafer Back Grinding Wheel
Used for wafer’s back thinning in LED and Semiconductor industries.
Specifications of Wafer Back Grinding Wheel
Product Specification
Available shape
Machine
GALAXY, SPEEDFAM
Working Condition
Grinding Type
Wet
